![]() ![]() Tip #3: Make sure the profiler is at least a full board’s length away from the board so that the thermal mass of the profiler does not affect the temperature results. Thermocouple wires can be fed through a sleeve to ensure they do not become entangled. Tip #2: It is best that the thermocouple wires are similar in length so they do not get tangled when going into the reflow oven. Make sure the Kapton tape does not cover the tip of the thermocouple where the temperature reading occurs. However, Kapton tape can be used to window pane around aluminum tape for extra security. Kapton tape is not recommended for attaching thermocouples because it is an insulator and generally does not produce accurate temperature readings.For multiple reflow cycles, the tape and/or epoxy may need to be reapplied over time. However, be careful not to poke holes in the tape. This three step profiling approach has been commonly used since the early days of SMT. A typical profile consists of three heating slopes (the time vs temperature relationship or rate of temperature rise) defined by Figure 3-1. If the thermocouples cannot be soldered, the next best method for attachment is to use thermally conductive epoxy or aluminum tape. The reflow profile is defined by the relationship of temperature versus time during heating.Soldering thermocouples to the solder joint with a high-melting temperature solder is the preferred method of attachment.Tip #1: Recommended thermocouple attachment method: Today, I will end this series with a few more tips. Previously in this blog series, we discussed some of the best practices for attaching thermocouples to a printed circuit board (PCB) for reflow profiling. SiP & Heterogeneous Integration & Assembly (HIA)Ī thermocouple attached to the bottom side of a component using aluminum tape secured with a window-pane of Kapton tape.The profiles differed in the reflow phase and the pre-heat phase when the soldering flux is activated. Four temperature profiles were used for the reflow soldering of testing boards. The Indium Corporation & Macartney Family Foundation This work aimed to evaluate the change of properties of joints based on bismuth-tin eutectic alloy soldered under various reflow conditions during long-term accelerated aging tests. ![]()
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